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Author Topic: copper technology in electronic circuit boards  (Read 1653 times)

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trankhanh_cr

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copper technology in electronic circuit boards
« on: January 03, 2017, 11:05:58 AM »

Hi everyone, I'm learning about copper technology in electronic circuit boards, someone could give me a document on this issue are not. Why copper atoms could be linked to the surface of the material, its link here is.
Thank you for reading.
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Borek

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Re: copper technology in electronic circuit boards
« Reply #1 on: January 03, 2017, 11:53:52 AM »

I am afraid what you posted doesn't make much sense. Are you using an automatic translator? If so, it has failed.

I would start googling for "laminating pcb with copper".
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Enthalpy

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Re: copper technology in electronic circuit boards
« Reply #2 on: January 04, 2017, 04:43:31 AM »

Neither am I sure to understand the question.

I've found no definitive information source. I suppose that the copper foils are laminated on the partly cured glass+epoxy composite ("prepreg"), and final curing of the epoxy glues the copper. Though, it seems that much work has been done to improve the adherence of the copper clad, so I can't exclude that an additional glue layer is used.

A manufacturer's website suggests that the copper film is initially thicker, and gets thinned (to 35µm or 70µm for instance) after it holds on the glass+expoxy.
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trankhanh_cr

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Re: copper technology in electronic circuit boards
« Reply #3 on: January 04, 2017, 06:26:25 PM »

Sorry, i am going rewrite it.
I am finding document for making CCL (copper clad laminate) by Electrodeposition....
Thanks....
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DrCMS

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Re: copper technology in electronic circuit boards
« Reply #4 on: January 04, 2017, 09:56:35 PM »

You might also want to look up the use of photoresists and etching.
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Hunter2

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Re: copper technology in electronic circuit boards
« Reply #5 on: January 06, 2017, 08:19:27 AM »

Sorry, i am going rewrite it.
I am finding document for making CCL (copper clad laminate) by Electrodeposition....
Thanks....

Copperclad material is manufactured by electrodepositing on Stainless steel coils.
https://www.rogerscorp.com/documents/749/acs/Copper-Foils-for-High-Frequency-Circuit-Materials.pdf
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Enthalpy

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Re: copper technology in electronic circuit boards
« Reply #6 on: January 07, 2017, 01:14:27 PM »

The same linked Pdf also cites lamination as a method to produce the copper foil from a billet. No idea which one is more common. Some patents indicate that the rough electrodeposited copper absorbs better the IR light from a laser used to pattern the copper, but this must be a marginal concern.

Whatever the method to obtain a copper film, it must adhere on the epoxy somehow.
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