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Specialty Chemistry Forums => Chemical Engineering Forum => Topic started by: Ely on February 01, 2007, 05:03:25 PM

Title: Copper Electroplating
Post by: Ely on February 01, 2007, 05:03:25 PM

Anyone can provide me explanation of the copper electroplating??
I want to know what happens during the process.
What is the purpose of using HCl and copper sulfate solutions??
I am hoping for answers.
Thank you very much.

Ely Rosales

Title: Re: Copper Electroplating
Post by: Donaldson Tan on February 02, 2007, 08:29:11 AM

HCl is used to control the thickness of the Copper layer deposited by electroplating. HCl changes the driving force of the copper electroplating process by adjusting the concentration of copper(II) cation via an equilibrium reaction:

Cu²⁺ (aq) + 4Cl^- (aq) <-> CuCl₄^2- (aq)