I think the TES want to achieve thickness without using current. This is possible with autocatalytical process. The methods what you suggest is immersion process what gives very thin layer and it stops if the metal below is covered. Thickness in nm size.
Autocatalytical process needs complex agent like EDTA, Quadrol, tartrate and reducer like formaldehyde, Hypophosphite or hydrazin, special additives for stabilizing and getting the right grain size. So used for copper or nickel.